Extreme ultraviolet alignment marks

ABSTRACT

The present disclosure describes a method to form alignment marks on or in the top layer of an extreme ultraviolet (EUV) mask blank without the use of photolithographic methods. For example, the method can include forming a metal structure on the top layer of the EUV mask blank by dispensing a hexacarbonylchromium vapor on the top layer of the EUV mask and exposing the hexacarbonylchromium vapor to an electron-beam. The hexacarbonylchromium vapor is decomposed to form the metal structure at an area which is proximate to where the hexacarbonylchromium vapors interact with the electron-beam. In another example, the method can include forming a patterned structure in the top layer of an EUV mask blank with the use of an etcher aperture and an etching process.

BACKGROUND

Photomask blanks (mask blanks) are the base material of reticles andmasks that are used as the patterning templates of circuits during thesemiconductor lithography process. Defects present on mask blanksincrease pattern defectivity on wafers during subsequentphotolithography steps. Therefore, defect reduction during mask makingis important for yield and throughput improvement.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with common practice in the industry, variousfeatures are not drawn to scale. In fact, the dimensions of the variousfeatures may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is an isometric view of an extreme ultraviolet (EUV) mask blank,according to some embodiments.

FIG. 2 is a flow diagram of a maskless method of making alignment markson an extreme ultraviolet (EUV) mask blank, according to someembodiments.

FIG. 3 is an isometric view of an extreme ultraviolet (EUV) mask blankwith metal alignment marks, according to some embodiments.

FIG. 4 is a top-down view of an etcher aperture, according to someembodiments.

FIG. 5 is a flow diagram of a method of making alignment marks on anextreme ultraviolet (EUV) mask blank, according to some embodiments.

FIG. 6 is an isometric view of an etcher aperture above an extremeultraviolet (EUV) mask blank, according to some embodiments.

FIG. 7 is a cross sectional view of an etcher aperture above an extremeultraviolet (EUV) mask blank in accordance with an alignment markformation method of this disclosure, according to some embodiments.

FIG. 8 is an isometric view of an extreme ultraviolet (EUV) mask blankwith etched alignment marks, according to some embodiments.

FIG. 9 is a cross sectional view of an extreme ultraviolet (EUV) maskblank with etched alignment marks, according to some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over a second feature in the description that followsmay include embodiments in which the first and second features areformed in direct contact, and may also include embodiments in whichadditional features may be formed that are between the first and secondfeatures, such that the first and second features are not in directcontact. In addition, the present disclosure may repeat referencenumerals and/or letters in the various examples. This repetition doesnot in itself dictate a relationship between the various embodimentsand/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The term “nominal” as used herein refers to a desired, or target, valueof a characteristic or parameter for a component or a process operation,set during the design phase of a product or a process, together with arange of values above and/or below the desired value. The range ofvalues is typically due to slight variations in manufacturing processesor tolerances.

The term “vertical,” as used herein, means nominally perpendicular tothe surface of a substrate.

The advanced lithography process, method, and materials described in thecurrent disclosure can be used in many applications, including fin-typefield effect transistors (FinFETs). For example, the fins may bepatterned to produce a relatively close spacing between features, forwhich the above disclosure is well suited. In addition, spacers used informing fins of FinFETs can be processed according to the currentdisclosure.

A reticle and a photomask each contain a pattern image to be reproducedin a photoresist (resist) coating on a wafer. A resist is a compoundthat undergoes a change in solubility in a developer solution due toexposure to an ultraviolet (UV) or extreme ultraviolet (EUV) light. Aresist can be a stack of one or more layers. A reticle contains thepattern image for a part of the wafer that is stepped and repeatedacross the entire wafer. The reticle's pattern image to be exposed isalso called “a shot” and may contain a pattern of several dies. Reticlesare used for step-and-repeat steppers and step-and-scan systems. Incontrast, a photomask, or mask, contains the pattern image for acomplete wafer die array and the pattern is transferred in a singleexposure through a 1:1 image transfer. Some benefits of using reticles,as opposed to masks, are the ability to print patterns on the wafer inthe submicron regime due to the larger pattern size on the reticle(e.g., 4:1 and 5:1) and the ability to adjust for individual diealignment and focus, which is advantageous when topography differencesare present across the wafer due to a film or process non-uniformity.

The repetitive imaging process imposes stringent requirements on thereticles. For example, in a reticle that contains the images of aparticular layer for four product dies in a shot, a single defect on thereticle is capable of causing product failure that reduces yield by 25%.Such a large yield loss from a single defect demands zero tolerance fordefects on the reticle. Because reticle defects and variations can bereproduced repetitively on a wafer, reticle defectivity needs to betightly controlled and constantly monitored through an inspectionprocess, which occurs periodically with the purpose of examining thecondition of the reticle before its re-use.

Reticles and masks are fabricated with techniques similar to those usedin typical wafer photolithography processing. As an example, a reticleor mask fabrication process begins with a mask blank, which includes anopaque film (top layer), usually chromium or chromium-containingcompounds, deposited on a low thermal expansion (LTE) material or quartzsubstrate. A coating of resist is applied on the mask blank. After theresist is exposed according to a circuit pattern, the exposed resist isthen developed to expose portions of the opaque material. The exposedportions of the opaque material are then etched. Finally, the remainingresist is stripped leaving behind the circuit pattern which has beenreproduced on the etched opaque material. Reticle patterning can beaccomplished using electron-beam (e-beam) writers, which are tools thatexpose the resist on the mask blanks according to suitably formattedlayouts of circuit designs. E-beam can provide high resolution patterns.But, e-beam has its disadvantages: speed and complexity.

Each reticle is aligned to the exposure tool's projection optics whenthe reticle is mounted on the reticle stage. Once aligned, the waferstage with the wafer is then aligned to the reticle. Duringfield-by-field alignment, the stepper steps to each shot location on thewafer, focuses, aligns, and then exposes the pattern within the shot onthe wafer. The specific details of stepper alignment systems are uniqueto each manufacturer due to the requisite control to align the reticleand wafer pattern within, for example, a few nanometers.

Mask blank defects increase pattern defectivity on wafers duringsubsequent photolithography operations. Particularly, for EUVphotolithography where the mask blanks are complex multilayerstructures, mask blanks are inspected in detail for defects before themain pattern is reproduced. Alignment marks at predetermined locationson the mask blank act as reference coordinates to determine and registerthe defect location by the inspection tools. Once a defect isidentified, its coordinates are registered (defect registration) usingthe alignment marks as reference points. When the mask blank proceeds tothe main patterning step, the registered coordinates of the defect areused to shift the main pattern so that the defect is reproduced on anon-critical area of the main pattern such as, for example in a “dummy”area.

Alignment marks can be formed prior to the main pattern formation usingsimilar fabrication methods to the pattern reproduction process on themask blanks described above. For instance, a coating of resist isapplied on the mask blank. The resist is exposed according to analignment mark pattern at specific predetermined locations, and theexposed resist is then developed. This will expose portions of the toplayer of the mask blank. The exposed portions of the top layer of themask blank are then etched. The remaining resist is stripped with a wetclean process that dissolves the remaining developed resist and leavesbehind an alignment mark pattern reproduced in the etched top layer ofthe mask blank. In other words, alignment mark formation requires acombination of additional photolithography and etch operations. Due tothis subsequent photolithographic and etching process repetition, forthe alignment mark formation and then for the main pattern transfer,there is a higher probability for defect generation due to the largenumber of processing steps involved. In addition, the process timeincreases, thus impacting manufacturing time and cost.

Various embodiments according to this disclosure provide processes whichdo not require a mask, resist application, exposure, or patterning ofthe resist to form alignment marks. As a result, fewer processingoperations are required and fewer defect particles are generated duringprocessing, thus reducing manufacturing time and cost.

FIG. 1 is an isometric view of an extreme ultraviolet (EUV) mask blank100, according to some embodiments. EUV mask blank 100 includes an LTEsubstrate material 110, a reflective multilayer 120, an absorber layer130, and a hard mask top layer 140. In some embodiments, LTE substrate110 is a titanium oxide (TiO₂) doped silicon oxide (SiO₂) amorphousglass with a chromium nitride (CrN) backside thin film (not shown). Insome embodiments, reflective multilayer 120 is a multilayer stack ofmolybdenum/silicon (Mo/Si) bi-layer having a total stack thickness ofabout 280 nm. A thin ruthenium (Ru) buffer/cap layer (not shown) isdisposed between absorber layer 130 and multilayer 120 to protectreflective multilayer 120. The thickness of the protective buffer layeris about 3.5 nm. In some embodiments, absorber layer 130 is tantalumboride nitride (TaBN) having a thickness of about 60 nm. In someembodiments hard mask top layer 140 is made of chromium (Cr) orchromium-containing compounds such as, for example, chromium nitride(CrN) or chromium oxynitride (CrON) having a thickness of about 6 nm. Aperson of ordinary skill in the art would appreciate that the layerthicknesses provided should not be considered limiting as these layerthicknesses may vary.

FIG. 2 is a flow diagram of a maskless method 200 of making alignmentmarks on an extreme ultraviolet (EUV) mask blank, according to someembodiments. In some embodiments, maskless method 200 is anon-photolithographic alignment mark method 200. Method 200 does notrequire a mask and resist to create the alignment marks on the EUV maskblank. Hence method 200 is considered “maskless” and “resistless.”Additional fabrication operations may be performed between the variousoperations of method 200, and are omitted merely for clarity. Masklessand resistless alignment mark fabrication processes in accordance withthis disclosure are not limited to fabrication process 200.

By way of example and not limitation, method 200 can occur in a dualbeam platform tool that has two columns: one column for e-beamgeneration and another column for ion beam generation. Alternatively,process 200 can occur in a scanning electron microscope (SEM) or ascanning transmission electron microscope (STEM).

E-beam induced deposition (EBID) of materials can be used to producelow-energy deposition that does not affect the underlying surface. Thisis contrary to ion-beam induced deposition (IBID), which is moreenergetic because ions are used instead of the smaller and lighterelectrons. The spatial resolution (spatial accuracy) for the EBIDprocess can be below 1 nm. The EBID process requires a high vacuum(e.g., 10⁻⁵ to 10⁻⁶ Torr) ambient to ensure that electron-mattercollisions do not occur away from the reaction surface, and electrons donot lose a significant amount of kinetic energy before reaching thereaction surface.

Method 200 begins with operation 202 where an EUV mask blank (e.g., EUVmask blank 100 of FIG. 1) is edge-aligned to the stage of a depositionchamber. During the edge-alignment process, the edges of both the maskblank and the stage are aligned relative to each other. This alignmentremains fixed for the remainder of the process.

In operation 204 the precursor vapor is introduced through a gas inleton a top surface of the EUV mask blank (e.g., hard mask top layer 140 ofFIG. 1) in the vicinity of a desired deposition site. The gas inlet isan orifice having a diameter that can be adjusted according to theprecursor's vapor pressure so that a constant flow of precursor isprovided during the deposition process. By way example and notlimitation, the precursor can be hexacarbonylchromium (Cr(CO)₆) that ispre-heated to a vapor before it is introduced on the deposition site.Pre-heating produces sufficient vapor pressure for a consistentprecursor flow throughout the deposition process. The precursormolecules are physically adsorbed on the mask blank's surface in thevicinity of the gas inlet but do not decompose at this stage. Physicaladsorption ensures that the precursor molecules are not chemicallyinteracting with the substrate and decompose.

In operation 206, an e-beam interacts with the physically adsorbedprecursor molecules and decomposes them to form Cr metal structures(alignment marks). The e-beam energy can have a range between 10 and 300keV; however this energy range can be high for precursor dissociation.Hence, a majority of the decomposition occurs through low energyelectron interaction with the physically absorbed molecules. Forexample, with secondary electrons or backscattered (inelasticallyscattered) electrons. As a result, the metal structures (alignmentmarks) can have a larger lateral size than the e-beam spot size, whichcan be as small as 0.045 nm. This phenomenon is known as the “proximityeffect” and is attributed to the secondary, backscattered, and forwardscattered (if the beam dwells on already deposited material) electronsthat contribute to the deposition and are not as tightly confined as theelectrons of the incoming e-beam. Depending on the e-beam's energy,these electrons can leave the substrate up to several microns away fromthe point of impact of the electron beam, and therefore materialdeposition is not necessarily confined to the irradiated spot. Toovercome this problem, compensation algorithms can be applied.

As the e-beam scans on the EUV mask blank's surface, Cr metal isdeposited when the e-beam's path and the hexacarbonylchromium physicallyadsorbed molecules cross and interact with each other. Hence, Cr metaldeposition can selectively occur on sites where the e-beam interactswith the physically adsorbed hexacarbonylchromium molecules.

Repeated physical adsorption and decomposition of the precursormolecules result in a buildup of Cr material in the e-beam scannedregion. The deposition rate depends on a variety of processingparameters such as, for example, a partial pressure of the precursor,substrate temperature, electron beam parameters, and applied currentdensity. The deposition rate can be in the order of 10 nm/s.

Additionally, by controlling the movement of the e-beam, any shape of Crmetal structures, or metal alignment marks, may be produced. Thescanning can be computer controlled for added precision. Some of theparameters in this process are the e-beam size, e-beam current, andprecursor vapor flow and partial pressure. A person of ordinary skill inthe art will appreciate that other metals compatible with thisdeposition technique may be used to form the alignment marks.

In this exemplary embodiment, the metal alignment marks (metalstructures) are formed over hard mask top layer 140 of EUV mask blank100 and have a height of about 70 nm, while their footprint is nominallyabout 50 μm by 50 μm. Due to the large size of the alignment marks, theproximity effects attributed to the secondary, backscattered and forwardscattered electrons are not a concern. The aforementioned dimensions arenot intended to be limiting, and larger or smaller alignment marks arepossible as long as proper defect registration is achieved during themask blank inspection. In this context, proper defect registration isthe successful identification of the defect's coordinates with respectto the alignment marks.

FIG. 3 is an isometric view of EUV mask blank 300 with metal alignmentmarks 310 (metal structures), according to some embodiments. EUV maskblank 300 is similar to EUV mask blank 100 and has metal depositedalignment marks 310. In some embodiments, deposited alignment marks 310are located over top layer 140 of EUV mask blank 100 instead of beingetched in top layer 140. Alignment marks 310 can be formed using, forexample, maskless and resistless fabrication process 200. In someembodiments, the number of alignment marks 310 is two or more (e.g.,three alignment marks). In some embodiments, the dimensions of eachalignment mark 310 is about 50 μm by 50 μm, where each alignment mark310 has a height of about 70 nm. A person of ordinary skill in the artwill appreciate that the number of alignment marks, their size, shapeand position on the EUV mask blank may be different depending on thedefect registration requirements during mask blank inspection.

FIG. 4 is a top-down view of an etcher aperture 400, according to someembodiments. Etcher aperture 400 includes openings 410 that extendthrough its entire thickness. Etcher aperture 400 is used as an etchmask, or shadow mask, during an etch process where a pattern of openings410 is transferred via etching in the EUV blank's top layer 140 to formsimilar size and shape patterned structure (alignment marks). In someembodiments etcher aperture 400 can be made of quartz. However, othersuitable materials compatible with the etch process can be used. In someembodiments, exemplary etcher aperture 400 has at least 3 openings 410of a desired shape. In some embodiments, etcher aperture 400 has athickness of about 2 mm. However, thicker or thinner etcher aperturescan be used depending on the etching process parameters. In someembodiments, etcher aperture 400 has nominally the same dimensions asEUV mask blank 100. A person of ordinary skill in the art willappreciate that the number of openings 410, their shape, lateraldimensions, and position on etcher aperture 400 may be differentdepending on the defect registration requirements during mask blankinspection.

FIG. 5 is a flow diagram of a method 500 of making alignment marks on anEUV mask blank, according to some embodiments. Method 500 can be used tofabricate alignment marks using etcher aperture 400. In some embodiment,method 500 does not require a resist application to etch the pattern ofthe alignment marks in the top layer of the EUV mask blank. Hence method500 is considered “resistless.” Other fabrication operations may beperformed between the various operations of method 500 and are omittedmerely for clarity. The resistless fabrication process of alignmentmarks is not limited to exemplary method 500.

Method 500 starts with operation 510, in which etcher aperture 400 isaligned, or centered, on top of EUV mask blank 100. This operationsecures the position of etcher aperture 400 in relation to EUV maskblank 100 so that the alignment marks are formed at desiredpredetermined locations in the top hard mask layer of EUV mask blank100. The alignment, or centering process, can be performed, for example,in the etch chamber before the etch process begins.

In operation 520, etcher aperture 400 is placed above the top layer EUVmask blank 100 such that a gap is formed between them. FIG. 6 is anisometric view of etcher aperture 400 placed above EUV mask blank 100with a gap 610 in between. FIG. 7 is a cross-sectional view along plane620 of FIG. 6, and shows gap 610. Gap 610 between EUV mask blank 100 andetcher aperture 400 is an adjustable parameter that depends on the etchprocess conditions such as, for example, the gas chemistry, the maskblank temperature, and radio frequency (RF) of the plasma source. Therelative position of etch aperture 400 and EUV mask blank 100 is fixedduring the etch operation to avoid poor alignment mark definition. Pooralignment mark definition can create defect registration issues duringmask blank inspection. By way of example and without limitation, thedistance between etcher aperture 400 and EUV mask blank 100 can benominally about 2 mm. During operation 520, an extensive undercut in toplayer 140 will result in poorly shaped alignment marks which may lead todefect registration errors. Therefore, undercut in top layer 140 is notdesirable unless it is controlled and uniform across the alignmentmarks.

In operation 530, a reactive ion etching (RIE) removes the areas of toplayer 140 below openings 410 until the exposed top layer 140 is removedand the alignment marks are formed as etched patterned structures in toplayer 140. In some embodiments, the RIE is sufficiently anisotropic toavoid extensive undercut. In some embodiments, the RIE is timed. In someembodiments, the RIE uses end-point detection (end-pointed), which meansthat the etch process is configured to automatically stop when the areasof top layer 140 below openings 410 have been sufficiently removed andportions of absorber layer 130 are exposed.

End point detection is possible because top layer 140 and absorber layer130 are made of different materials. Consequently, these layers havedifferent etch rates for a given etching chemistry. For example, toplayer 140 can have a significantly higher etch rate than absorber layer130 (e.g., greater than 2:1). Top layer 140 can be made of Cr orCr-containing compounds such as, for example, CrN and CrON. On the otherhand, absorber layer 130 can be TaBN. When top layer 140 is removed andabsorber layer 130 is exposed, the etch rate abruptly drops. This dropin the etch rate is detected by in-situ metrology equipment such as, forexample, an optical emission microscope. Since the optical emissionmicroscope can be integrated into the etch chamber, real-time monitoringof the etch process is possible.

Depending on the thickness uniformity of top layer 140, the RIE may beeither timed, end-pointed, or a combination of the two. By way ofexample and without limitation, the RIE can be timed during thebeginning of the process, and end-pointed towards the end of theprocess. In some embodiments, the RIE chemistry is chlorine-based. Aperson of ordinary skill in the art will appreciate that other etchingchemistries are possible, and the selection of the etch chemistry can bemade based on the selectivity ratio between the material of top layer140 and the material of the underlying absorber layer 130. Duringoperation 530, in some embodiments, only the areas of top layer 140 thatare directly exposed to plasma are removed such as, for example, theareas directly below openings 410.

The etch process is sufficiently anisotropic so that the etchedalignment marks (patterned structures) in top layer 140 have similar orslightly larger size compared to openings 410 in etcher aperture 400. Insome embodiments, anisotropic RIE ensures there is negligible, or no,undercut. Gap 610 between EUV mask blank 100 and aperture etcher 400,and the RIE process conditions will impact the anisotropy of the RIEprocess and the resulting shape/size of the formed patterned structuresor alignment marks. A person of ordinary skill in the art willappreciate that the aforementioned parameters can be modifiedaccordingly to ensure accurate alignment mark formation via an etch intop layer 140.

At this point patterned structures, the alignment marks, have beenformed by etching portions of top layer 140. After the etch removalprocess has been completed, etcher aperture 400 is removed from the topof EUV mask blank 100. Alternatively, etcher aperture 400 remains inplace and EUV mask blank 100 is removed from the etch chamber.

In operation 540, and depending on the integration scheme, an optionalwet or dry clean process may be performed to remove any residue leftbehind from the etching process or to clean the surface from particlesin preparation for the next operation.

FIG. 8 is an isometric view of EUV mask blank 800, similar to exemplaryEUV mask blank 100, with etched patterned structure or alignment marks810, according to some embodiments. Alignment marks 810 can be formedusing exemplary resistless method 500. Alignment marks 810 appear asetched “trenches” in top layer 140, having a depth equal to thethickness of top layer 140. In some embodiments, the number of alignmentmarks 810 is at least three. In some embodiments, the dimensions ofalignment marks 810 are about 50 μm by 50 μm (length×width). Howeverthis should not be considered a limitation, and smaller or largeralignment marks are possible. A person of ordinary skill in the art willappreciate that the number of alignment marks, their shape, dimensionsand position on top layer 140 of the EUV mask blank may be differentfrom the disclosure herein.

FIG. 9 is a cross sectional view of EUV mask blank 900 taken along plane820 of EUV mask blank 800 shown in FIG. 8. In this view, alignment marks810 appear as openings in top layer 140. Because of the etch selectivitydifference between top layer 140 and absorber layer 130, absorber layer130 under alignment marks 810 is not recessed or otherwise damagedduring the RIE process. If the selectivity between top layer 140 andabsorber layer 130 is poor (e.g., less than 2:1), then alignment marks810 would extend in absorber layer 130.

Alignment marks can be formed prior to a main pattern formation usingsimilar fabrication methods to a pattern reproduction process on maskblanks. For example, alignment mark formation can require a combinationof additional photolithography and etch operations. Due to thisrepetition of photolithographic and etching processes for alignment markformation and main pattern transfer, the probability of defectsincreases due to the large number of processing steps involved. Inaddition, due to the repetition of the photolithographic and etchingprocesses, manufacturing time increases as well.

Embodiments of this disclosure address these defect and time issues byproviding maskless and/or resistless methods and device structures. Themaskless and/or resistless process can include formation of thealignment marks through metal deposition (e.g., directly) on the toplayer of an EUV mask blank to form metal structures, or formation ofalignment marks with etching of the EUV mask blank's top layer throughan etcher aperture to form patterned structures. The maskless and/orresistless process, among other things, simplifies the alignment markformation and does not involve costly and time-consuming lithographicprocess steps. Lithographic process steps can be the source of defects.Several benefits of embodiments in accordance with this disclosureinclude simplified and fewer processing steps, mitigation of particlegeneration during processing, and overall manufacturing cost reductionthrough tool throughput improvements. And by facilitating the detectionand repair of mask or reticle defects, wafer defectivity is alsobeneficially reduced.

In one embodiment, a method includes an EUV mask blank that includes asubstrate material, a reflective multilayer, an absorber layer, and atop layer. The EUV mask blank is edge-aligned to a stage in a depositionchamber. A metal structure is formed without a resist on the top layerof the EUV mask blank. The formation of the metal structure includesdispensing a hexacarbonylchromium vapor on the top layer of the EUV maskand exposing the hexacarbonylchromium vapor to an electron-beam. Thehexacarbonylchromium vapor is decomposed to form the metal structure atan area which is proximate to where the hexacarbonylchromium vaporsinteract with the electron-beam.

In another embodiment, a method an EUV mask that includes a substratematerial, a reflective multilayer disposed over the substrate material,an absorber layer disposed over the reflective multilayer, and a toplayer disposed over the absorber layer. A patterned structure is formedwithout a resist in the top layer of the EUV mask blank. The formationof the patterned structure includes an etcher aperture with a pluralityof openings, where the etcher aperture is aligned to the EUV mask blank.The etcher aperture is placed above the top layer of the EUV mask blankso that a gap is allowed between the etcher aperture and the top layerof the EUV mask blank. The top layer of the EUV mask blank is etchedthrough the openings of the etcher aperture to form an etched patternedstructure in the top layer of the EUV mask blank and expose part of theabsorber layer. The patterned structure is formed in the top layer ofthe EUV mask blank, below the plurality of openings of the etcheraperture. A clean process removes a residue from the etching of the toplayer.

In another embodiment, an apparatus includes a reflective multilayerdisposed over a substrate material, an absorber layer disposed over thereflective multilayer, a top layer disposed over the absorber layer, anda plurality of alignments marks. Each of the alignments marks is formedon or in the top layer of the EUV mask blank.

It is to be appreciated that the Detailed Description section, and notthe Abstract of the Disclosure section, is intended to be used tointerpret the claims. The Abstract of the Disclosure section may setforth one or more but not all possible embodiments of the presentdisclosure as contemplated by the inventor(s), and thus, are notintended to limit the subjoined claims in any way.

The foregoing disclosure outlines features of several embodiments sothat a person of ordinary skill in the art may better understand theaspects of the present disclosure. A person of ordinary skill in the artwill appreciate that they may readily use the present disclosure as abasis for designing or modifying other processes and structures forcarrying out the same purposes and/or achieving the same advantages ofthe embodiments introduced herein. A person of ordinary skill in the artwill also realize that such equivalent constructions do not depart fromthe spirit and scope of the present disclosure, and that they may makevarious changes, substitutions, and alterations herein without departingfrom the spirit and scope of the present disclosure.

What is claimed is:
 1. A method comprising: providing an extremeultraviolet (EUV) mask blank comprising a substrate material, areflective multilayer, an absorber layer, and a top layer; edge-aligningthe EUV mask blank to a stage in a deposition chamber forming, without aresist, a metal structure on the top layer of the EUV mask blank,wherein the forming comprises: dispensing a hexacarbonylchromium vaporon the top layer of the EUV mask; exposing the hexacarbonylchromiumvapor to an electron-beam; and decomposing the hexacarbonylchromiumvapor to form the metal structure at an area proximate to where thehexacarbonylchromium vapors interact with the electron-beam.
 2. Themethod of claim 1, wherein the metal structure comprises chromium Cr. 3.The method of claim 1, wherein the top layer of the EUV mask blankcomprises chromium (Cr), or a chromium-containing compound.
 4. Themethod of claim 1, wherein the electron beam has an energy that rangesfrom 10 to 300 keV and a spot size of at least 0.045 nm.
 5. The methodof claim 1, wherein the metal structure comprises a plurality ofalignment marks.
 6. The method of claim 5, wherein the plurality ofalignment marks comprises at least three alignment marks.
 7. The methodof claim 5, wherein each alignment mark of the plurality of alignmentmarks has a height of about 70 nm.
 8. The method of claim 5, whereineach alignment mark of the plurality of alignment marks has area of atleast 10 μm by 10 μm.
 9. A method comprising: providing an extremeultraviolet (EUV) mask blank comprising a substrate material, areflective multilayer disposed over the substrate material, an absorberlayer disposed over the reflective multilayer, and a top layer disposedover the absorber layer; and forming, without a resist, a patternedstructure in the top layer of the EUV mask blank, wherein the formingcomprises: providing an etcher aperture with a plurality of openings;aligning the etcher aperture to the EUV mask blank; placing the etcheraperture above the top layer of the EUV mask blank leaving a gap betweenthe etcher aperture and the top layer of the EUV mask blank; and etchingthe top layer of the EUV mask blank through the plurality of openings toform an etched patterned structure in the top layer of the EUV maskblank and expose part of the absorber layer, wherein the patternedstructure is formed in the top layer of the EUV mask blank below theplurality of openings of the etcher aperture; and performing a cleanprocess to remove a residue from the etching the top layer.
 10. Themethod of claim 9, wherein the gap between the etcher aperture and thetop layer of the EUV mask blank is nominally 2 mm.
 11. The method ofclaim 9, wherein the etching the top layer of the EUV mask blankcomprises etching the top layer of the EUV mask blank using a reactiveion etching (RIE) process, wherein the RIE process comprises a timedetch, an end pointed etch, or a combination thereof.
 12. The method ofclaim 11, wherein the RIE process comprises a substantially anisotropicprocess to minimize an undercut in the top layer of the EUV mask blank.13. The method of claim 11, wherein the RIE process comprises achlorine-based chemistry.
 14. The method of claim 11, wherein the RIEprocess is substantially selective to the top layer of the EUV maskblank.
 15. The method of claim 910, wherein the top layer of the EUVmask blank comprises chromium (Cr) or chromium-containing compounds andhas a nominal thickness of 6 nm.
 16. The method of claim 9, wherein theabsorber layer comprises tantalum boride nitride (TaBN).
 17. The methodof claim 9, wherein the plurality of openings in the etcher aperturecomprises at least 3 openings.
 18. The method of claim 9, wherein theetcher aperture comprises quartz.
 19. An apparatus comprising: areflective multilayer disposed over a substrate material; an absorberlayer disposed over the reflective multilayer a top layer disposed overthe absorber layer; and a plurality of alignment marks, wherein eachalignment mark of the plurality of alignment marks is formed on or inthe top layer of the EUV mask blank.
 20. The apparatus of claim 19,wherein each alignment mark of the plurality of alignment marks has anominal thickness of 70 nm and a nominal depth of 6 nm.